Job Description

Job Description

Company Overview:

“Always the Best, Always Fun!”

DISCO Corporation is a global powerhouse in precision cutting, grinding, and polishing solutions, with a reputation for excellence across the semiconductor, medical devices, and electronic component industries. Headquartered in Tokyo, Japan, we are a forward-thinking company with a strong presence in 60+ locations worldwide with a diverse team of 7,000+ employees. Our success is driven by our core DISCO values that emphasize trust, continuous innovation, and an unwavering commitment to quality. At DISCO, we pride ourselves on fostering an inclusive culture where employees thrive, grow, and contribute to shaping the future of technology.

DISCO Corporation’s U.S affiliate, DISCO Hi-Tec America, Inc. (DHA), is looking to expand our Equipment Engineering/Field Service Engineering team! We are currently people who bring fresh perspectives, new ideas, and unique skills to join us as a Field Service Engineer in our Boise, ID office.

Key Responsibilities:

After training period, you should be able to:

• Install, maintain, troubleshoot, and repair DISCO grinding, dicing, and laser equipment at customer sites, ensuring top-tier performance and customer satisfaction. Independently diagnose complex issues through rigorous electrical/mechanical procedural sequences.
• Document analytical steps and root causes for internal teams and customers.
• Foster strong customer relationships to provide reliable support onsite and offsite, including possible training of customers' personnel in servicing, maintenance, and operations of DISCO products.
• Work with cutting-edge robotics, cameras, electrical motor components, and sophisticated software.
• Participate in DISCO corporate activities focusing on deeper thinking, value exchange, and constant improvement.
• Perform other duties as assigned.

Preferred Experience and Qualifications:

• Bachelor of Science degree in any discipline preferred.
• Strong aptitude for electro-mechanical repair, with the ability to troubleshoot and fix intricate systems.
• Familiarity with lab instrumentation, CAD drawings, electrical diagrams, MS Office, and general computer programming.
• Knowledge of semiconductor processes, lasers fundamentals, optics fundamentals, or semiconductor industrial engineering and operation is a plus.
• 2-4 years of applicable working experience or hands-on experience with similar technical field (HVAC, Automotive, etc) is ideal.
• Military experiences are welcome.
• Japanese reading and writing ability is a plus.

Physical Requirements:

• Lift and move up to 30 lbs. and work in varied physical positions to access hard-to reach areas on our equipment.
• Wear personal protective gear for extended periods during on-site work.

Interpersonal Skills:

• Clear, concise, and effective communication skills to interact with colleagues, customers, and leadership.
• A high degree of self-motivation and creativity, with the ability to perform under pressure, even in challenging situations.
• A natural ability to build strong relationships, maintaining trust and teamwork within a global company, building upon DISCO’s culture to help build an inclusive work environment.
• Willingness to lead peers on projects and act as a resource for colleagues.

DISCO Hi-Tec America, Inc. is committed to Equal Employment Opportunity and diversity in its workforce without discrimination

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